AMD has announced the availability of two new hybrid (APU) G series processors. The newbies meant to be used inside embedded systems and features TDP value of 5.5 and 6.4W. According to manufacturer, this is 39% lower compared to previously released models. Die size of new APUs is 361mm2. Tiny size and little power consumption makes it very attractive for compact embedded systems, for example, information boards, industrial mobile devices, mini computer modules, etc.
Buddy Broeker, director, Embedded Solutions, AMD, said:
We have seen many of our embedded customers deploy fanless systems even with our 15W TDP processors in the past. Today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement. System designers can now unleash their creativity without being constrained by heat or size issues.
APU config includes two Bobcat (x86) cores and a GPU supporting DirectX 11 APU, located on a single piece of silicon.
Low power drawn allows new APU be cooled with a passive heatsink, which sometimes is crucial requirement when deigning embedded systems. In particular, when devices should operate with minimal noise level generated. Sometimes active cooling can become a weak link due to possible fan stopping when filled with dust which can lead to system damage. Besides, passive cooling can reduce system cost.
The list of products based AMD’s latest low-power APUs includes Amtek made industrial mobile device, single-board PC of Pica-ITX form-factor manufactures by Axiomtek, datakamp computer models of Qseven (70mm x70mm) and information board platform with passive cooling produced by iBASE. More device to launch in future.