GLOBALFOUNDRIES to Showcase Innovative Design Solutions for 28nm and Beyond at DAC 2011

Press release: Industry’s only truly collaborative approach to design enablement delivers value, performance, and time-to-volume at leading-edge technologies

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At next week’s 48th Design Automation Conference (DAC) in San Diego, Calif., GLOBALFOUNDRIES will demonstrate how its innovative approach to ecosystem collaboration has helped deliver the industry’s most comprehensive design platform for advanced technologies. The company will feature a full complement of design infrastructure for its 28nm High-k Metal Gate (HKMG) technology, including silicon-validated flows, process design kits (PDKs), design-for-manufacturing (DFM), and intellectual property (IP) from leading companies. GLOBALFOUNDRIES also will showcase approaches to overcoming new design challenges as the industry moves to 20nm and beyond.

GLOBALFOUNDRIES’ 28nm HKMG technology leverages learning from a high-volume ramp on 32nm HKMG technology. Currently the only foundry in the world shipping leading-edge HKMG products for customers, the company is expected to ship more HKMG volume in 2011 than all other foundries combined. The 28nm technology, which is optimized for SoC-based mobile devices, uses the same 32nm HKMG implementation that has now reached volume production. This “Gate First” approach to 28nm technology offers longer battery life for mobile products with higher performance and lower cost, while providing the full entitlement of scaling from the 45/40nm node, with a 10-20% cost saving over HKMG solutions offered by other foundries.

Mojy Chian, senior vice president of design enablement at GLOBALFOUNDRIES, said:

At GLOBALFOUNDRIES, we have been in production of real HKMG products for months. We have been leveraging this experience by collaborating with ecosystem partners to build this knowledge into the design infrastructure and tools we provide to customers at 28nm. This focus on early design-technology co-optimization and silicon validation will translate to accelerated time-to-market for the next generation of power-sensitive consumer electronics and mobile devices.

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